Pi Gold Finger Tape
OPALUS PACK manufactures Pi Gold Finger Tape for PCB gold finger protection and connector contact protection during wave solder, reflow, selective soldering, and plating boundary work. As a manufacturer, we focus on narrow connector edge masking, clean removal, and stable tape edges after short high-temperature exposure. The tape helps keep gold-plated contacts free from solder splash, flux migration, and adhesive transfer, especially where a clean electrical contact surface is required after assembly.
- Common size: 3 mm to 500 mm width, 33 m or 66 m length
- Color: amber brown
- Material: polyimide film
- Adhesive: silicone pressure sensitive adhesive
- Thickness: 0.035 mm to 0.10 mm
- Use: PCB gold finger and connector edge protection
Product Overview
Pi Gold Finger Tape is not a general PCB masking tape. It is made for the narrow contact area at the PCB edge, where gold fingers or connector pads must stay clean after soldering. In this area, even a small flux mark, solder stain, or residue line can affect inspection results or long-term connection reliability.
The tape uses polyimide film with a controlled silicone adhesive layer. During sample process checks, we commonly evaluate edge holding and removal behavior around 245-260C peak reflow conditions, with short dwell exposure similar to SMT assembly. The useful result is not only heat resistance, but whether the tape stays flat, keeps a straight boundary, and peels away without disturbing plated contacts.
For real production, the details matter. A dusty board surface, stretched tape, poor edge pressure, or an unsuitable adhesive thickness can allow flux or solder to creep under the masking line. OPALUS PACK controls coating, slitting, and die-cutting so slit rolls, strips, and kiss-cut parts can be used for repeatable connector edge masking.
Benefits
- Protects gold fingers from solder splash, flux marks, and contact contamination
- Helps maintain a cleaner masking line during wave solder and reflow exposure
- Supports clean removal under validated process conditions
- Reduces edge lift risk when the tape is applied to a clean, dry PCB surface
- Narrow-width slitting helps match connector layouts without covering nearby pads
- Controlled adhesive thickness balances wet-out, peel force, and low residue performance
- Available for manual placement, semi-automatic placement, and automatic placement formats
How Does Pi Gold Finger Tape Keep the Connector Edge Clean During Soldering?
Pi Gold Finger Tape works by forming a temporary heat-resistant boundary at the connector edge. The key point is edge contact before heating. If the surface has oil, dust, or flux residue, the adhesive may not wet out evenly, and solder or flux can move along the tape edge during wave soldering. A clean PCB surface, firm edge pressure, and the right adhesive thickness help reduce solder intrusion and gold finger contamination.
TDS
| Item | Typical Value |
|---|---|
| Backing material | Polyimide film |
| Adhesive type | Silicone pressure sensitive adhesive |
| Color | Amber brown |
| Total thickness | 0.035 mm – 0.10 mm |
| Adhesive thickness | 0.015 mm – 0.045 mm, project based |
| Standard width | 3 mm – 500 mm slit roll |
| Width tolerance | +/-0.1 mm to +/-0.5 mm, depending on slit width |
| Roll length | 33 m, 66 m, 100 m, or custom length |
| Short-term heat reference | 245C – 260C reflow peak after validation |
| Peel adhesion | Medium tack, adjusted by adhesive grade |
| Removal observation | Low residue on approved PCB surfaces after process check |
| Placement format | Roll, strip, die-cut part, kiss-cut on liner |
| Suggested validation | Test with actual PCB finish, flux, dwell time, and peel timing |
Applications
- PCB gold finger protection during wave soldering
- Connector edge masking for card-edge connectors and test contacts
- Reflow soldering protection for plated contact areas
- Plating or soldering boundary masking where contact surfaces must remain clean
- Selective soldering protection on narrow connector layouts
- Temporary masking for repeated EMS production using slit rolls or die-cut strips
When Should Pre-Cut Strips Be Used Instead of Hand-Cut Rolls?
Pre-cut strips are useful when the same connector layout is masked repeatedly. Hand-cut tape can vary in width, length, and edge straightness, especially on narrow gold finger areas. Die-cut or kiss-cut strips give operators a consistent shape to place, which helps reduce alignment variation across repeated PCB builds. They are also easier to use with semi-automatic or automatic placement when the line needs stable masking position from board to board.
FAQ
Is this tape only for gold finger areas?
It is mainly designed for PCB gold finger protection, connector contact protection, and connector edge masking, not broad-area PCB masking.
Can it be removed without residue?
It is designed for clean removal under validated soldering conditions. Actual residue depends on PCB finish, temperature profile, dwell time, and peel timing.
What width should be used for connector masking?
The width should cover the gold finger boundary with enough overlap to seal the edge, without interfering with nearby pads, holes, or inspection marks.
Can OPALUS PACK supply die-cut parts?
Yes. OPALUS PACK can produce narrow slit rolls, straight strips, and kiss-cut parts for manual, semi-automatic, or automatic placement.