Double Sided Polyimide Tape
OPALUS PACK manufactures double sided polyimide tape for electronic assembly work where two surfaces need controlled bonding and heat-stable positioning. Built with a polyimide film carrier, adhesive coating on both sides, and a release liner, this tape is used for FPC/PCB temporary bonding, fixture holding, insulation film lamination, and precision die-cut parts. It is designed for process stability up to 260C while keeping both adhesive faces predictable during handling and placement.
- Material: Polyimide film carrier with double-sided adhesive coating
- Color: Amber, clear amber, or custom shade
- Adhesive: Silicone PSA, acrylic option by process requirement
- Total Thickness: Typical 50-200 um
- Release Liner: PET or fluorosilicone liner, typically 50-100 um
- Format: Slit rolls, sheets, kiss-cut parts, tolerance from +/-0.1 mm
Product Overview
This double coated polyimide tape is made for bonding tasks where single-sided masking tape cannot provide enough holding force. Its structure includes a PI film carrier, two controlled adhesive layers, and a release liner that protects the exposed adhesive before use. Common film options include 12.5 um, 25 um, and 50 um, with adhesive thickness adjusted for bonding strength, stack height, and die-cut requirements.
For FPC and PCB assembly, the liner is not just packaging. It keeps the tape flat during kiss-cutting, reduces adhesive contamination, and supports clean release during manual or automated placement. This matters because thin flexible circuits, spacers, and small insulation pads can shift or curl if liner release force and adhesive flow are not balanced.
Benefits
- Provides dual-surface bonding for temporary holding, lamination, and fixture mounting.
- Works as a high temperature bonding tape with stable exposure up to 260C, with short process checks near 280C.
- Peel adhesion is typically 0.8-1.8 N/cm on stainless steel after dwell time, depending on adhesive type and substrate.
- Helps reduce edge lift when applied with even roller pressure; poor pressure may leave air pockets and lower wet-out.
- Suitable as FPC fixing tape where flexible circuits must stay aligned before curing, reflow, or lamination.
- Supports precision die-cut parts, including small shapes around 1-3 mm, when liner release and adhesive flow are controlled.
What is double sided polyimide tape used for in high-precision electronic assembly?
Double sided polyimide tape is used when two materials must stay aligned during heat, pressure, or assembly movement. In FPC and PCB work, it is selected for flexible circuit positioning, insulation film bonding, spacer fixing, and temporary holding before reflow or thermal curing. Its value is controlled adhesion on both sides, so bonded layers stay steady without adding unnecessary thickness.
TDS
| Item | Typical Value |
|---|---|
| Film Carrier | Polyimide film |
| Film Thickness | 12.5 um, 25 um, 50 um optional |
| Adhesive Type | Silicone PSA, acrylic PSA optional |
| Adhesive Coating | Double-sided coating |
| Total Tape Thickness | 50-200 um typical range |
| Release Liner | PET or fluorosilicone liner |
| Release Liner Thickness | 50-100 um typical |
| Peel Adhesion | 0.8-1.8 N/cm on stainless steel |
| Continuous Temperature Resistance | Up to 260C |
| Short-Term Temperature Resistance | Up to 280C, process dependent |
| Die-Cut Registration Accuracy | <=0.2 mm typical |
| Slitting Tolerance | +/-0.1 mm typical |
| Dielectric Strength | 5-7 kV typical |
| Recommended Lamination Pressure | Even roller pressure, edge-to-edge application |
| Removal Suggestion | Peel slowly below 45 degrees after validation |
Applications
- FPC temporary bonding where thin flexible circuits need stable positioning before heat processing.
- PCB assembly adhesive tape use for holding insulation films, spacers, and small adhesive pads.
- High-temperature fixture holding for electronic parts exposed to reflow or thermal curing cycles.
- Lamination of PI film, PET film, copper foil, or insulation layers where pressure uniformity affects adhesion.
- Kiss-cut and die-cut parts used in compact electronic modules, sensors, battery components, and precision assemblies.
- Automated placement parts where liner release force, adhesive edge cleanliness, and part flatness affect pickup reliability.
How does release liner and double-sided adhesive structure influence bonding stability and die-cut processing?
The release liner affects both converting quality and bonding stability. A 50-100 um PET or fluorosilicone liner keeps the adhesive surface clean, supports kiss-cut processing, and reduces curling in small die-cut shapes. During bonding, pressure should move from one edge to the other to push out trapped air. For thin FPC or PCB surfaces, low-angle peeling below 45 degrees is recommended during removal trials to reduce surface stress.
FAQ
Is this the same as single-sided polyimide masking tape?
No. This product has adhesive on both sides and is designed for bonding, holding, lamination, and die-cut parts. Single-sided polyimide tape is mainly used for surface masking.
Which adhesive system is better for high-temperature use?
Silicone PSA is usually preferred for high-temperature stability. Acrylic adhesive may be selected for non-silicone requirements, different tack, or residue control.
Why does bonding strength change after lamination?
Bonding strength depends on pressure, dwell time, substrate surface energy, and temperature exposure. Even roller pressure improves wet-out and reduces edge lift.
Can the tape be made into small die-cut parts?
Yes. With the right liner and adhesive balance, it can be slit, sheeted, kiss-cut, or die-cut with typical registration accuracy within <=0.2 mm.