Conductive Aluminum Foil Tape
Conductive aluminum foil tape is made for electronic assemblies that need EMI/RFI shielding, grounding, and stable electrical continuity across metal joints, enclosure seams, and cable shield interfaces. OPALUS PACK manufactures this tape with a conductive aluminum backing and a conductive adhesive layer, so it works as a conductive shielding tape rather than a general aluminum tape. Typical tested values include 0.05 – 0.5 ohm/sq surface resistance and 60 – 90 dB shielding effectiveness, depending on overlap width, bonding pressure, substrate condition, and frequency range.
- Material: Aluminum foil with conductive acrylic adhesive
- Color: Silver metallic
- Thickness: 50 – 120 um
- Width: 10 – 500 mm factory slit
- Surface resistance: 0.05 – 0.5 ohm/sq
- Working temperature: -20 C – 120 C
Product Overview
OPALUS PACK produces conductive aluminum foil tape for electronic housings, shielded cable assemblies, PCB enclosures, and chassis bonding points where ordinary foil tape cannot provide dependable electrical contact through the adhesive layer. The product is positioned as an EMI shielding tape and grounding tape for electrical continuity, not as a duct, repair, or building-use aluminum tape.
The aluminum foil backing provides the main conductive surface, while the conductive adhesive bridges the interface between the tape and the substrate. This is important on painted metal, lightly oxidized aluminum, plated parts, or removable covers where direct metal-to-metal contact may be inconsistent. In these assemblies, the weak point is often the joint, screw area, cable entry, or overlapping shield edge rather than the large metal panel itself.
With suitable pressure and overlap width, the tape helps create a lower-resistance path across these discontinuities. It can reduce EMI leakage at enclosure gaps and maintain grounding continuity without adding rigid metal straps or extra wires.
Benefits
- Helps maintain EMI/RFI shielding continuity across enclosure seams, access panels, and overlapping joints
- Provides a conductive bonding path where mechanical contact alone may be unstable
- Supports grounding continuity in chassis, PCB housing, and electronic cabinet assemblies
- Reduces high-frequency leakage at small gaps, edges, and irregular contact areas
- Conductive adhesive improves Z-axis contact through the bond line, not only along the foil surface
- Performs more consistently when vibration, repeated handling, or thermal cycling may affect contact points
How do real installation conditions affect EMI shielding performance?
Conductive aluminum foil tape performs best when pressed firmly onto a clean conductive surface and applied with enough overlap to avoid narrow leakage paths. In internal sample checks, contact resistance stayed closer to the low mOhm range when bonding pressure was even across the seam. Poor pressure, surface dust, heavy oxidation, or a very narrow overlap can increase interface resistance. For enclosure seams, a 10 – 20 mm overlap is often more stable than a narrow edge bond, especially around corners or removable panels.
TDS
| Item | Typical Value |
|---|---|
| Product Type | Conductive aluminum foil tape |
| Backing Material | Aluminum foil |
| Adhesive System | Conductive acrylic pressure sensitive adhesive |
| Total Thickness | 50 – 120 um |
| Standard Width Range | 10 – 500 mm |
| Roll Length | 20 m, 25 m, 30 m, or 50 m |
| Surface Resistance | 0.05 – 0.5 ohm/sq |
| Contact Resistance | <= 50 mOhm under recommended bonding pressure |
| Shielding Effectiveness | 60 – 90 dB, 1 MHz – 1 GHz |
| Adhesion to Steel | >= 15 N/25mm |
| Temperature Range | -20 C – 120 C |
| Recommended Overlap Width | 10 – 20 mm for enclosure seams |
| Recommended Application Pressure | 2 – 5 N/cm |
| Release Liner | Paper liner or film liner |
| Main Function | EMI/RFI shielding, grounding, electrical continuity |
Applications
- Electronic enclosure shielding for control units, instruments, and communication devices
- Cable harness shielding where flexible conductive wrapping is needed around branches or joints
- Chassis grounding between metal panels, covers, frames, and conductive mounting points
- PCB housing bonding where shield layers need a stable path to enclosure ground
- Metal surface continuity bridging across coated, plated, or mechanically joined components
- Industrial electronic assemblies requiring conductive shielding tape for signal integrity protection
What affects long-term grounding stability in electronic enclosure applications?
Grounding stability depends on more than the foil surface. The adhesive interface, filler distribution, overlap area, and surface condition influence how the conductive path behaves over time. If the substrate has oxide buildup or uneven coating, the tape may still bond mechanically, but the electrical contact area can be reduced. Vibration can also shift micro-contact points inside the adhesive layer. OPALUS PACK recommends checking both surface resistance and contact resistance during material selection, especially for enclosures exposed to heat cycles, moving harnesses, or repeated opening and closing.
FAQ
What is conductive aluminum foil tape mainly used for?
It is used for EMI/RFI shielding, grounding, conductive bonding, and electrical continuity in electronic enclosures, cable harnesses, and metal assemblies.
How is it different from standard aluminum foil tape?
Standard foil tape may conduct along the foil surface, but conductive aluminum foil tape uses conductive adhesive to support electrical contact through the bonded interface.
What surface resistance is typical?
A typical surface resistance range is 0.05 – 0.5 ohm/sq, depending on foil thickness, adhesive formulation, and test conditions.
How much overlap is recommended for shielding seams?
For electronic enclosure seams, 10 – 20 mm overlap is commonly recommended to improve shielding continuity and reduce leakage at joint edges.