Anti Static Polyimide Tape
Anti static polyimide tape is an ESD control tape manufactured by OPALUS PACK for electronics assembly where low static unwind, clean removal, and controlled charge dissipation are required. It uses polyimide film with an anti-static treated surface or adhesive layer to reduce charge generated during unwind, placement, and removal. This tape is not a conductive tape. It is made for ESD-sensitive assembly, PCB/FPC protection, and electronics packaging without creating a direct electrical path.
- Material: Polyimide film with anti-static treated film or adhesive surface
- Color: Amber ESD-treated finish, other shades by grade
- Thickness: 0.05 mm, 0.06 mm, 0.08 mm common options
- Adhesive: Silicone PSA, acrylic option for silicone-sensitive processes
- Surface Resistance: 10^6 – 10^9 ohm/sq reference range
- Format: Log roll, slit roll, sheet, or die-cut tape parts
Product Overview
OPALUS PACK produces anti static polyimide tape for factories that handle static-sensitive parts and need more than standard high-temperature PI tape. In electronics plants, static is often created when tape is pulled from the roll, pressed onto a surface, or peeled away after processing.
This ESD polyimide tape reduces friction-related charge generation. The treated surface helps the tape act as a static dissipative material, while the polyimide backing keeps the film stable during short thermal exposure and assembly handling. It is useful when operators need thin protection, steady adhesion, and lower static behavior near electronic parts.
In OPALUS PACK internal handling checks, low static unwind grades kept peak unwind voltage below about 50V under controlled test conditions. Standard polyimide tape tested at the same handling speed showed higher charge buildup, especially in dry air. Values depend on humidity, roll width, unwind speed, contact surface, and grounding condition, so samples should be tested on the real production line before approval.
This product is not a grounding material, EMI shielding tape, or conductive adhesive tape. Its main value is controlled static reduction during temporary bonding and protection.
Benefits
- Helps reduce static generated during unwind, application, and removal
- Supports safer handling around sensitive electronic components
- Low static unwind improves stability in dry or fast-moving assembly areas
- Polyimide film keeps dimensional stability during heat-related process steps
- Clean removal reduces residue risk after validated dwell time and temperature
- Slit rolls and die-cut formats improve repeatable placement work
What should engineers check before replacing standard PI tape?
Before changing from standard PI tape to static dissipative tape, engineers should confirm the actual process problem. If the line only needs heat resistance, standard PI tape may be enough. If operators see static attraction, dust pickup, component disturbance, or high peel voltage during removal, an ESD control tape is more suitable. A useful trial should check unwind behavior, residue after heat exposure, liner release, and removal from the real PCB, FPC, plastic film, or coated metal surface.
TDS
| Item | Typical Value |
|---|---|
| Product Type | Anti static polyimide tape |
| Backing Material | Polyimide film |
| Surface Treatment | Anti-static treated film or adhesive surface |
| Adhesive Type | Silicone PSA, acrylic option available |
| Total Thickness | 0.05 – 0.08 mm |
| Width Range | 3 – 500 mm |
| Roll Length | 33 m, 36 yd, or custom |
| Surface Resistance | 10^6 – 10^9 ohm/sq reference |
| Unwind Static Voltage | <50V under internal controlled test |
| Temperature Resistance | Up to 260 C short process exposure |
| Dielectric Strength | >=5 kV typical |
| Removal Behavior | Clean removal after validated process conditions |
| Storage Condition | 20 – 25 C, dry area, avoid UV and solvent vapor |
| Available Format | Slit roll, sheet, die-cut part on liner |
Applications
- ESD-sensitive electronics assembly and repair stations
- PCB and FPC temporary protection during handling
- Component positioning where low static behavior is required
- Electronics packaging with controlled static performance
- Thin-film, sensor, connector, and module protection
- Die-cut pads, strips, tabs, or frames for repeatable placement
How does storage and handling affect ESD tape performance?
Anti-static performance can change if rolls are stored poorly or handled in an uncontrolled area. High heat, moisture, solvent vapor, or sunlight exposure can affect adhesive stability and surface behavior. Keep rolls sealed until use, let cold rolls return to room temperature before opening, and avoid touching the adhesive with bare hands. In dry workshops, static risk rises, so humidity control, grounded workstations, and correct handling still matter. The tape supports an ESD control program; it does not replace one.
FAQ
Is anti static polyimide tape the same as conductive tape?
No. It is a static dissipative tape, not a conductive tape. It helps control charge buildup but does not create a current-carrying path.
Can it be die-cut for small electronic parts?
Yes. OPALUS PACK can supply slit rolls or die-cut parts on liner for tabs, strips, pads, frames, and repeatable shapes.
Will it remove cleanly after heat exposure?
It is designed for clean removal under validated process conditions. Residue should be tested on the actual surface because dwell time, temperature, and surface finish affect results.
What information is needed before ordering samples?
Useful details include thickness, roll width, surface resistance target, adhesive type, process temperature, removal requirement, application surface, and manual or machine use.